*Corporate Profile
Trade Name: Matsuno Kanagata Seisakusho, K.K.
Representative: Yukihide Matsuno, President
Established: April 1, 1975
Head Office: 4-10, Shinjo-Higashi, Higashi Osaka City, Osaka, Japan 578-0951
Phone: +81-6-6746-2717
Fax: +81-6-6746-2846
Shin Yokohama Plant: 267, Kawawa-cho, Tsuzuki-ku, Yokohama City, Kanagawa, Japan 224-0057
Kyushu Kiyama Plant: 350-1, Kiyama-cho Nagano, Miyaki-gun, Saga, Japan 841-0202
Paid-in Capital: 10,000,000 yen
Annual Turnover: 848 million yen (year ended March 2009)
Banks: Yoshida Branch, Nanto Bank, Ltd.
Higashi Osaka Branch, Shoko Chukin Bank
Higashi Osaka Chuo Branch, The Bank of Tokyo-Mitsubishi UFJ, Ltd.
Higashi Osaka Branch, The Daisan Bank, Ltd.
Kadoma Branch, Bank of Kyoto, Ltd.
*Number of Employees (as of April 2009): 58 (male: 52, female: 6)
*Business Line: Design and manufacture of precision metal dies for plastic molding use
*Main Products (as of April 2009)
Metal dies for injection molding of: mobile phones; digital still cameras; battery chargers; two color molded products; front panels, buttons, and batteries for automobiles; magnesium dies; mechanical parts; packaged battery cases, etc.
*Brief History
April 1975: Established in Iwata-cho, Higashi Osaka City
April 1977: Incorporated as Matsuno Kanagata Seisakusho, K.K.
March 1982: New plant established in Shinjo-Higashi, Higashi Osaka City
1990: Plant site expanded
February 2002: Tokyo Sales Office opened in Kami-Osaki, Shinagawa-ku, Tokyo
October 2002: New plant established in Kawasaki City. Tokyo Sales Office relocated to the new plant.
June 2004: Yukihide Matsuno became representative director
May 2005: New equipment introduced
MOLD720h system jointly developed with Makino Milling Machine Co., Ltd.
April 2007: Shin-Yokohama Plant opened in Yokohama City.
Kawasaki Plant relocated to the new plant.
May 2007: Opened R&D Laboratory in incubation room of Creation Core Higashi Osaka, Higashi Osaka City
April 2008: Kyushu Kiyama Plant opened in Kiyama-cho, Saga
June 2009: Shin-Yokohama Plant relocated to present location